TIF100-30-06US 1.5mm To 5.0mm Thick 1.5W Ultra Soft Silicone Pad For CPU GPU Semiconductor Heat Dissipation Thermal Pad
Product descriptions
Ziitek TlF®100-30-06US is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.
Features
> Good thermal conductive 1.5W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses
> Broad range of hardnesses available
> Outstanding thermal performance
Application
> Mainboard/mother board
> Notebook
> Power supply
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components
> IT infrastructure
> GPS navigation and other portable devices
> CD-Rom, DVD-Rom cooling
> Monitoring the Power Box
> AD-DC Power Adapters
> Rainproof LED Power
> Waterproof LED Power
> SMD LED module
> LED Flesible strip, LED bar
| Typical Properties of TIF®100-30-06US Series |
| Property | Value | Test method |
| Color | White | ***** |
| Construction &Compostion | Ceramic filled silicone elastomer | ***** |
| Specific Gravity | 3.0g/cc | ASTM D297 |
| Thickness range | 0.020"~0.250" | ASTM D374 |
| Hardness | 18 Shore 00 | ASTM 2240 |
| Continuos Use Temp | -40 to 160℃ | ***** |
| Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 |
| Dielectric Constant | 4.0 MHz | ASTM D150 |
| Volume Resistivity | 1.0X10¹² Ohm-meter | ASTM D257 |
| Flame rating | 94 V0 | UL E331100 |
| Thermal conductivity | 3.0W/m-K | ASTM D5470 |
Standard Thicknesses
0.020-inch to 0.20 inch (0.5mm to 5.0mm)
Product Sizes:
8" x 16"(203mm x406mm)
Individual die cut shapesand and custom thickness can be supplied.
Please contact us for confirming
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Independent R&D team
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TIF100-30-06US 1.5mm To 5.0mm Thick 1.5W Ultra Soft Silicone Pad For CPU GPU Semiconductor Heat Dissipation Thermal Pad Images
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